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Home / Ascension 30 gm Thermal Grease Paste Heat Sink Compound for CPU and Chipsets (Grey) Ceramic Based Thermal Paste(1 g 5 W/mK)
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Ascension 30 gm Thermal Grease Paste Heat Sink Compound for CPU and Chipsets (Grey) Ceramic Based Thermal Paste(1 g 5 W/mK)

Grey Thermal Grease is ISOL 6, Heat Sink Compound is a non-curing, water resistant paste heavily filled with heat conductive metallic oxides in a Silicone base. It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis, there by increasing the overall efficiency of the component / device. Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers. Also used as a non-flammable coating for fly back transformer connections in TV chassis and similar applications. Features : High Thermal Conductivity Low Thermal Resistance Electrically Non-Conductive Non-Curing Non-Capacitive Non-Corrosive Bleed resistant Temp resistant from -50 to 210 C.


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Product Details

: "1 Thermal Grease Paste Heat Sink"

Brand: "Ascension"
Model Number: "OP1087"
Model Name: "30 gm Thermal Grease Paste Heat Sink Compound for CPU and Chipsets (Grey)"
Type: "Ceramic Based"
Quantity: "1 g"
Viscosity: "30 Pa-s"
Thermal Conductivity: "5 WmK"
Composition: "etc"
Net Quantity: "1 g"

Key Features: "Material : ISOL 6, Heat Sink Compound, Weight : Approx. 30 g, Color : Grey."

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